Foxlink Group, the expertise in ODM, JDM service for worldwide 4C leading companies by providing intergrated technology competence in Optics, Mechanisam, Electronics and Acoustics
   
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  Focus on Time to Market
At Foxlink we believe that effective design support for new products requires providing customer collaborative service that we are capable of achieving time-to-market target. For every project, Foxlink creates specific engineering team in the early stage of product development, dedicating to reach customers' requirements from conceptual designs to specification. In addition, Foxlink's unique advantage in its knowledge of design for manufacturing, enabling to evaluate each aspect of design to improve performance. Ultimately, our analytical expertise and engineering experience ensure that the design chosen will be functional and moldable.

Foxlink is focusing on new product design, optimization and introduction services, while positioning the company as a joint design manufacturer (JDM). This approach demonstrates that we build our manufacturing business by streamling real value-added activities before any part are produced. Accordingly, our solution for new product development helps customers be more profitable by identifying, developing and filling market niches with new products faster than the competition while reducing costs through more efficient use of research and development resources.

Peeking into the future of new product development,  we see a highly collaborative virtual environment designed to speed time to market, increase innovation, improve quality and reduce overall development costs. We are now investing in tools to support real-time collaboration of a fully integrated cross-functional product creation team within a supply chain:

CAD ( Computer Aided Design for 3D solid modeling) : Parameter-based drawing, Customerized components modeling, 2D/3D data base for components modeling, Direct linkages for CAM and CAE, Rapid 3D structure and color design
CAE (Computer Aided Engineering): Plastic deformation simulation for structure mechanics, Drop and vibration simulation for portable electronics, Thermal simulation for electronic products, Acoustic simulation, Coupled-field and Multi-filed simulation, Engineering optimization designElectrical Performance Analysis: PCB signal integrity and power integrity, EM simulation for high-speed electrical connector, Internal and embedded antennas simulation, RLGC extraction for connector contact and PCB track
Product Lifecycle Management (PLM)/Product data management system (PDM)

Design & Development
Material Development:
Halegen-free Flame Retardant Nano Coating, The Development of Resin Recycling Technology, The Development of Metal/Ceramic Nano Composition Plating Technology, Anti-microbial Technology
Mechanical-Electrical Development: Color eBook Panel LED Lighting Technology, Thermal Solutions for a Pico Projector, Development of Energy Harvesting Technology Integration on Mouse and Wireless Controller
Image Processing Technology: Quality Enhancement of the Color Image Sequence, 3D Stereo Image Sensor Synchronization Method, Auto Loader and Unloader for FPC, Digital Factory Planning & 3D Simulation with ROBOT System, AOI for Surface Defect Inspection
Metal Secondary Technology: 
SUS 304 Shell Cold Drawing Technology Development, Continuous Insert Molding Technology